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China chipmaker Unigroup secures 150b yuan to expand globally

Financing is from government-backed China Development Bank and a national chip fund

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Tsinghua Unigroup Ltd has clinched as much as 150 billion yuan (S$30.4 billion) of financing from two Chinese government-backed investors, amassing a pool of funds to pursue acquisitions and build a world-class semiconductor industry.

Beijing

TSINGHUA Unigroup Ltd has clinched as much as 150 billion yuan (S$30.4 billion) of financing from two Chinese government-backed investors, amassing a pool of funds to pursue acquisitions and build a world-class semiconductor industry.

The state-linked chipmaker will receive

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