AEM’s thermal engine selected for fabless provider’s system-level test insertions

AEM’S thermal engine was selected by a “major fabless provider of high-performance compute and artificial intelligence (AI) semiconductor chips” as the plan of record for its system-level test insertions.

A plan of record is a mutually agreed business plan approved by senior management.

AEM’s thermal engine is tailored for high-volume manufacturing, and excludes traditional chlorofluorocarbon cooling fluids.

It is “strategically designed to cater to the evolving test needs of the customer’s new device road map”, added the group.

Initial deliveries are scheduled to commence in FY2024, and the company expects to make subsequent ones in the years to follow.

On Monday (Apr 22), the mainboard-listed semiconductor equipment maker said this marks a “significant milestone” for the expanded adoption of its active thermal control solutions for upcoming AI devices with high-power thermal demands.

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AEM chief executive Chandran Nair said: “This recognition underscores our relentless commitment to innovation and customer-centricity.”

Shares of AEM ended Friday S$0.07 or 3 per cent lower at S$2.29.