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S'pore, US sign MOU to take infrastructure tie-ups to next level
Published Tue, Aug 2, 2016 · 09:50 PM
Washington, DC
SINGAPORE and the US have signed an agreement to foster greater collaboration between their companies in the infrastructure sector.
The memorandum of understanding, inked in Washington on Monday (Tuesday morning, Singapore time) will also promote technology partnerships between Singapore and American firms in third-party markets.
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