Chan Yip Pang

A demonstration of robots assembling chips during the Semicon South-east Asia 2026 event in Kuala Lumpur in May 2026.
DUE DILIGENCE

Beyond the assembly line – Can Malaysia climb the semiconductor value chain?

Access to financial services would benefit all the participants in the ecosystem. Startups that manage to scale, first from a single product, will eventually broaden to be an all-encompassing multi-product neobank covering 5 facets: spending,  saving, investing, borrowing and protecting
DUE DILIGENCE

The future of fintech: From digital lenders to neobanks