Pall Corp boosts semiconductor market with US$100 million manufacturing facility
Yong Hui Ting
FILTRATION, separation and purification technology company Pall Corporation broke ground for a US$100 million manufacturing facility in Singapore on Tuesday (Aug 30), making it the latest addition to the nation’s recent wave of investments in the chip making sector.
When fully operational, the new facility is expected to more than double Pall’s current production capacity and strengthen its position in Singapore as a regional and global hub for a US$1 trillion industry, the company said in a statement.
The site, spanning 7 acres in the Jurong industrial area, will hold more than 18,000 square meters of manufacturing and office space.
It is estimated that the facility will spawn 300 new jobs for associates in science, engineering and manufacturing — individuals who will help the company incorporate advanced technologies into its manufacturing processes.
The ground-breaking ceremony on Tuesday was graced by Minister of State for Trade and Industry Alvin Tan, as well as Casey Mace, deputy chief of mission for the US Embassy.
Pall Corporation expects its high-volume manufacturing (HVM) and research and development capabilities to be completed between late 2023 and early 2024.
“The US$100 million investment demonstrates its commitment to helping customers meet extremely challenging defect reduction goals amid a global chip-shortage crisis as new technologies, such as 5G, artificial intelligence and automation, evolve and continue to drive transformation,” said Naresh Narasimhan, president of Pall Corporation.
The global chip shortage is being worsened by an industry-wide manpower shortage.
Pall Corporation’s new injection puts it among big names like Infineon, Soitec and United Microelectronics Corporation, which have, in the last few months, also announced fresh rounds of investments to expand their manufacturing capacities in Singapore.
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