STATS ChipPAC unveils cost-saving mfg process

SEMICONDUCTOR packaging and testing services company STATS ChipPAC yesterday unveiled a new manufacturing process which it hopes will reduce costs by 15 to 30 per cent for some of its customers.

The new process, called FlexLine, delivers an "unmatched level of flexibility" and cost savings for wafer level packaging (WLP).

WLP is a technique that involves packaging an integrated circuit (IC) while still part of the wafer, in contrast to the more conventional method of slicing the wafer into individual circuits and then packaging them.