STATS ChipPAC's new technology sees strong demand

STATS ChipPAC yesterday said that its more advanced semiconductor technology - unveiled two months ago - has seen strong demand and accelerated adoption across its customer base.

The chip maker said that its encapsulated Wafer Level Chip Scale Project (eWLCSP) solution, which is aimed at future electronics markets including space-constrained mobile devices and wearable technology, has made possible new benefits of superior quality, lower cost structure and ease of conversion for fan-in wafer level packaging.

WLCSP is one of the fastest growing segments in the semiconductor industry, driven by mobile electronics that require compact, high performance packages. But though a mature technology, there are concerns about the possibility of damage to the bare die package during the surface mount technology process, when components are mounted onto the surface of printed circuit boards.