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STATS ChipPAC's new technology sees strong demand
Published Tue, Jul 29, 2014 · 10:00 PM
STATS ChipPAC yesterday said that its more advanced semiconductor technology - unveiled two months ago - has seen strong demand and accelerated adoption across its customer base.
The chip maker said that its encapsulated Wafer Level Chip Scale Project (eWLCSP) solution, which is aimed at future electronics markets including space-constrained mobile devices and wearable technology, has mad…
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